AMD Mobile Sempron 3100+ - SMN3100BIX3BA information

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Type:CPU	Manufacturer:AMD
family:Mobile Sempron	microprocessors:AMD Mobile Sempron 3100+ - SMN3100BIX3BA

Type	CPU / Microprocessor
Market segment	Mobile
Family	AMD Mobile Sempron
Model number	3100+
CPU part number	SMN3100BIX3BA is an OEM/tray microprocessor
Stepping codes	CBBFD CBBHD
Frequency	3100+ (rated) 1800 MHz (real)
Clock multiplier	9
Package	754-pin lidless organic micro-PGA
AMD Package number	27973
Socket	Socket 754

Architecture / Microarchitecture

Microarchitecture	K8
Processor core	Georgetown
Core stepping	DH-D0
CPUID	10FC0
Manufacturing process	0.09 micron
The number of cores	1
The number of threads	1
Floating Point Unit	Integrated
Level 1 cache size	64 KB instruction cache 64 KB data cache
Level 2 cache size	256 KB
Multiprocessing	Uniprocessor
Features	MMX instructions 3DNow! technology SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 EVP / Enhanced Virus Protection
Low power features	PowerNow! technology

Integrated peripherals / components

Integrated graphics	None
Memory controller	The number of controllers: 1 Memory channels: 1 Supported memory: DDR
Other peripherals	One 16-bit HyperTransport link with speeds up to 800 MHz

Electrical / Thermal parameters

V core	1.4V
Maximum operating temperature	95°C
Thermal Design Power	62 Watt

other microprocessors

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